摘要
观察分析了S i3N4陶瓷/Nb/Cu/N i/Inconel600界面处反应层的形貌、元素分布、反应层中的相结构、界面反应以及反应层的生长规律,研究了S i3N4陶瓷/Nb/Cu/N i/Inconel600界面处反应层的形成机制.研究结果表明:在连接过程中,Cu层首先熔化,Nb、N i向液态Cu中扩散溶解形成Cu-Nb-N i合金,液态合金中的Nb和N i向S i3N4表面扩散聚集并与S i3N4反应形成反应层;S i3N4侧的反应层主要物相是NbN和Nb、N i的硅化物,N i基合金侧反应相主要是NbN i3和Cu-N i合金;在连接温度为1403 K的条件下,随着连接时间的增加,界面反应层厚度先快速增加,再缓慢增加.
Mechanism of interfacial reaction between Si3N4 ceramic and Nb/Cu/Ni interlayer was studied in this paper. The microphotograph, element distribution and phase structure in reaction layer was investigated. Interfacial reaction was analyzed from the standpoint of thermodynamics and the change of reaction layer thickness was also observed and analyzed, The results showed that Nb and Ni dissolved into molten Cu to form Cu - Nb - Ni liquid alloy and then diffused to the surface of Si3 N4 to form reaction layer. The reaction layer near Si3N4ceramic was rich in Si and N element,and the main products inside it were NbN and the silicide of Nb, Ni. The reaction layer at the side of Ni based alloy was rich in Cu, the main products in it were NbNi3 and Cu - Ni alloy. When bonding temperature was 1403 K, reaction layer grew fast at first and then slow down with the increase of bonding time.
出处
《材料科学与工艺》
EI
CAS
CSCD
北大核心
2006年第4期400-403,407,共5页
Materials Science and Technology
基金
山东省自然科学基金资助项目(Z2002F03)
