摘要
从塑封微电路(PEM)的物理性能和主要可靠性问题出发,介绍了将PEM应用于高可靠领域(如航空、航天、军用)中可能产生的风险,探讨了为降低使用风险而采用的升级筛选、质量鉴定、可靠性评价等方法和技术手段。
The possible risks brought by applying PEM to high-reliability fields （such as aviation, aerospace and military） was introduced from the viewpoint of physical performance and reliability issues of PEM. The risk mitigation methods such as upsereen, quality qualification and reliability evaluation were discussed.
出处
《电子产品可靠性与环境试验》
2006年第4期53-58,共6页
Electronic Product Reliability and Environmental Testing
