摘要
在原有的雾面锡电镀工艺基础上,增加了封闭工序。给出了工艺流程及各步骤的工艺规范。测试结果表明,镀层48h中性盐雾试验、155℃8 h恒温试验和270℃15 s高温试验,外观无明显变化;1000 h“双85”湿热试验,未发现有锡须生长;封闭后的雾面锡镀层仍有良好的可焊性。该工艺适合滚镀、挂镀及连续镀。
Based on the old non-bright tin electroplating, the sealing process was added. The process flow and technical regulation were presented. The test results show that after 48 h neutral salt spray test, 8 h constant temperature test at 155 % and 15 s high temperature test at 270 %, the deposit has no obvious changes; After 1 000 h ＂double 85＂ wet-hot test, no tin whiskers growth was found. The non-bright tin deposit has good solderability after sealing. The above process is fit for barrel plating, rack plating and continuous plating.
出处
《电镀与涂饰》
CAS
CSCD
2006年第6期8-10,共3页
Electroplating & Finishing
关键词
雾面锡
电镀锡
封闭
可焊性
性能测试
non-bright tin
tin eleetroplating
sealing
solderability
performance test
