摘要
设计了一套硅片专用真空夹紧装置,包括夹紧装置和微型无油真空抽气泵。为减少硅片在夹紧过程中变形,夹紧装置采用了多吸口、回旋槽的平面型结构;根据所需夹紧力大小,设计了抽速为0.3 L/s的微型真空泵,泵内无油避免了对硅片的污染;对间隙返流进行了计算并分析了对泵性能的影响;对气路进行了特殊设计使得硅片装卸方便、快捷。
A vacuum clamp equipment used for holding silicon wafer is designed in this paper. The system is composed of a sucking device and an oil-free mini vacuum pump. The sucking devices has a sucking-disk structure which contains multi-sucking mouths and gyral grooves in order to minimize the deformation of the wafer. An oil-free mini vacuum pump with pumping speed of 0.3 L/s is designed in order to provide proper holding force and keep the wafer from contaminating. The pumping speed is calculated while back-flow of various clearances is taken into account. The carefully designed pumping route makes the operation fast and easy.
出处
《真空电子技术》
2006年第2期36-39,共4页
Vacuum Electronics
关键词
真空夹具
Si片
微型泵
旋片泵
Vacuum clamp
Silicon wafer
Mini-pump
Sliding vane rotary pump
