摘要
采用真空热压扩散结合工艺制备出ＳｉＣｆ／Ｔｉ－１５—３复合板材．研究制备工艺，ＳｉＣｆ基体合金特性，复合材料的显微组织及界面特征结果表明，合适条件下国产射频加热ＣＶＤ法制备的ＳｉＣｆ与Ｔｉ－１５—３基体具有较好的相容性，界面结合良好在拉伸条件下ＳｉＣｆ有从基体拔出的倾向，纤维具有脆性解理断口特征，Ｔｉ－１５—３基体具有塑性断口特征．
SiC fibre reinforced Ti-15-3 composite was prepared by vaccum hot press diffusion-bonding technique.SiC fire,Ti-15-3 matrix and composite was metallographically examined. Reaction zone of interface between fibre and matrix was observed.It is identified that home-made SiCf prepared by radio frequency heat CVD process have resonable compatibility with Ti-15-3 matrix in proper conditions.Under a condition of tension stress SiC fibre possesses a tendency to pull-out from matrix.Fracture surface of fibre appears brittle pattern and fracture surface of Ti-15-3 matrix appears ductile dimple pattern.
出处
《材料研究学报》
EI
CAS
CSCD
1996年第3期329-332,共4页
Chinese Journal of Materials Research
关键词
金属基
复合材料
真空热压扩散
显微组织
metal matrix eomposite vaccum hot press diffusion bonding SiC fibre titanium alloy micrastructure
