摘要
在叙述极限电流密度的基础上,讨论施加电流或电位脉冲后所引起电极附近反应粒子浓度的变化,脉冲极限电流密度及其与脉冲参数的关系。同时论述脉冲电镀中传质对沉积层结构和沉积效率的影响。
In relation to the limiting current density,this paper discusses the variation of the reacting particle concentration as well as the relationship between pulse limiting current density and its pulse pamameters after applying current or potential pulse.In addition, it discusses the effect of mass transfer on deposite structure and deposite efficiency.
出处
《表面技术》
EI
CAS
CSCD
1990年第4期18-24,共7页
Surface Technology
关键词
脉冲电镀
电流密度
极限电流
pulse plating
limiting current
theoretical study
