摘要
介绍了Ka波段LTCC(低温共烧陶瓷)组件中矩形波导-微带的一种新型转换结构。这种转换结构通过波导和微带间的开槽耦合以及在LTCC多层布线基板中用金属填充通孔阵列等效替换波导壁而实现。此类型波导到微带的转换无需将安装在波导内的LTCC基板加工成特殊形状,便于加工,而且转换对LTCC基板和波导的机械安装公差要求较低。
A new type of Ka-band rectangular waveguide-to-microstrip transition in LTCC （Low Temperature Co-fired Ceramic） modules is described based on the principle of slot coupling between waveguide and microstrip, and the substitution of metal filled via holes for waveguide walls in LTCC multi layer substrates. This type of waveguide-to-microstrip transition eliminates the need for specially shaped LTCC substrate inside the waveguide, and it is tolerable for small errors in mechanical misalignment between the LTCC substrate and the rectangular waveguide.
出处
《微电子学》
CAS
CSCD
北大核心
2006年第2期171-172,176,共3页
Microelectronics
基金
国家高技术研究发展(863)计划资助项目(2005AA123730)
关键词
毫米波
波导-微带转换
低温共烧陶瓷
Millimeter-wave
Waveguide-to-microstrip transition
Low temperature co-fired ceramic
