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p-Si上电沉积Ni-W合金薄膜 被引量:2

The Electrodeposition of Nickel-Tungsten Films on p-type silicon
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摘要 利用恒电流沉积法,在p-Si上制备出不同W含量和不同结构的Ni-W薄膜,研究了镀液温度,pH值,电流密度对镀层组成的影响,结果表明,提高温度有利于获得高W含量的合金.随着镀层中W含量的增加,Ni面心立方晶格f.c.c发生正畸变,晶粒平均尺寸变小,当W含量达到56%以上时,晶粒小于2nm,薄膜呈非晶态结构. Nickel-tungsten films with different content of W and different structure were prepared by means of galvanostatic electrodeposition. The influence of temperature, pH value and current density on the composition of deposits was investigated. Experimental results showed that a rise in temperature is favorable to the increase of W content. X-ray diffraction was used to determine the film structure. With increase of W content. the f. c. c lattice of nickel is distorted, and the average size of grains becomes smaller. When the content of W in deposits reaches to about 56/00, the size of grains decreases to below 2 nm and the film has an amorphous structure.
出处 《应用化学》 CAS CSCD 北大核心 1996年第2期11-14,共4页 Chinese Journal of Applied Chemistry
基金 国家自然科学基金
关键词 电沉积 合金薄膜 非晶态 p-type silicon, nickel-tungsten alloy, electrodeposition, amorphous state
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