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电铸金刚石-镍复合膜微观应力分析

Analysis of micro stress in diamond grains-nickel composite film
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摘要 用电铸方法,采用低应力电镀液,研制出了金刚石-金属复合膜。该复合膜的厚度为20-45μm,可用于制作超薄切割刀具。介绍了用X射线衍射法(XRD)测量多晶体微观应力的基本原理和用X射线衍射法测量镍多晶体显微应变的程序。用单波法计算了电铸金刚石-镍复合膜的显微应变,并用扫描电镜(SEM)观察了该复合膜的表面形貌。结果发现:阴极电流密度严重影响复合膜的显微应变,在实验所用电流密度范围内(0.6-3.5 A/dm2),随着电流密度的增加,显微应变减小。 In this paper, diamond grains-nickel composite films with thickness of 20-45μm were deposited by using electrutyping method at the condition of low internal stress electrolytic solution. The films can be used to fabricate cutting blade. The basic theory about the measuring of micro stress by using X-ray Diffraction (XRD) and the procedure of the measuring of micro strain in nickel crystal were introduced, and the micro strain in the film was investigated by single-wave method. Scanning Electron Microscope (SEM) was used to test the micro morphology of the film. It was found that the electric current density of cathode strongly affected the micro strain in the film, which decreased by increasing the electric current density at the range of 0.4-2.5A/dm^2.
出处 《金刚石与磨料磨具工程》 CAS 北大核心 2005年第6期34-37,共4页 Diamond & Abrasives Engineering
关键词 金刚石-镍复合膜 显微应变 XRD SEM diamond grains-nickel film micro strain XRD SEM
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参考文献3

  • 1孙毓超等编著..金刚石工具与金属学基础[M].北京:中国建材工业出版社,1999:476.
  • 2范雄主编..X射线金属学[M].北京:机械工业出版社,1981:284.
  • 3杨于兴.X射线衍射分析[M].上海:上海交通大学出版社,1994. 被引量:12

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