摘要
陶瓷四边引线扁平外壳由于其具有I/O端子数多、重量轻、体积小、表贴式的特点,可 较好地满足集成电路芯片高可靠性封装要求。文章叙述了CQFP陶瓷四边引线扁平外壳设计中应注意的 一些问题。如对产品结构、内引线键合指、外引线外形、互连孔位置等关键技术工艺进行周密设计,才 能保证产品的质量。
CQFP can meet the requirements of high reliability packaging in IC, because of its multiple ports, light weight, small volume and SMT. Some questions in CQFP design are described in this paper, such as product structure, ILB-Inner Lead Bonding, ILB-Outer structure and VIA＇ s position in order to pledge quality of product.
出处
《电子与封装》
2005年第12期20-22,共3页
Electronics & Packaging
关键词
结构
键合指
外引线
互连孔位
装配
Structure
W/B
ILB-Outer
VIA＇s Position
Assembly
