摘要
从理论上分析了红外无损伤检测技术在热封封口质量检测时的热传导方程,并运用有限元技术对影响热封质量的因素进行了数值分析,讨论了影响最大温差的因素,该结论对红外无损伤检测法在软包装的应用具有重要指导意义。
A finite element modeling （FEM） using ANSYS is applied to simulate the temperature changing of the IR imaging. It analyses the theory of the heat conduction and discusses the factor that influence the most temperature - difference. This study investigates the effectiveness of IR imaging for the prediction of non - destructive packaging seal quality and identification of channel leaks.
出处
《包装工程》
CAS
CSCD
北大核心
2005年第6期5-7,共3页
Packaging Engineering
关键词
红外无损伤检测
有限元
泄漏通道
IR non- destructive imaging
finite dement
channel leak
