摘要
表面安装技术在电子产品组装生产过程中正得到广泛应用。而印制板的合理设计是SMT技术中的关键,也是SMT工艺质量的保证,着重讲述一些与印制板设计与制作相关的工艺技术问题,并给出了常见焊盘工艺设计参数。
Surface Mount Technology is extensively applied in the assembly of electronic components and PCBs, PCB design is the key of Surface Mount Technology and guarantee of SMT quality. The paper talks about some technology problems related with design and fabrication of PCB and offers technical parameter of bonging pad design.
出处
《印制电路信息》
2005年第6期26-34,共9页
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