摘要
本文详细介绍SMT无铅焊接钎料及其工艺特点，对无铅再流焊的相关典型缺陷进行了分析，并提出了有效的预防措施以及进行无铅焊接返工的几个关键问题。
This paper details the SMT lead-free soldering material together with its technological features. The typical defects related to the soldering is analyzed. Effective prevention measures and a few key problems with the rework is also given in this paper.
出处
《通信与广播电视》
2005年第3期60-62,共3页
Communication & Audio and Video
