摘要
对Sn3.0Ag2.8Cu/Cu焊点等温时效后其界面组织的变化进行了SEM、OM以及EDX分析研究,并与Sn37Pb/Cu焊点进行了比较。结果表明:在焊料与铜基板界面上存在Cu6Sn5和Cu3Sn两种金属间化合物,时效过程中Sn3.0Ag2.8Cu焊料与铜的生长速度较慢,金属间化合物的生长属于扩散控制。
The interface microstructure of Sn3.0Ag2.8Cu/Cu solder joint undergoing aging was studied with a comparison to that of Sn37Pb/Cu. Through SEM, OM and EDX analyses, it was found that there were two kinds of intermetallic compounds, Cu6Sr5 and Cu3Sn, at the interface of solder and copper. The reaction rate of Sn3.0Ag2.8Cu with Cu during aging was smaller than that of Sn37Pb/Cu. The growth rate of intermetallic compound was controlled by diffusion.
出处
《机械工程材料》
CAS
CSCD
北大核心
2005年第11期21-24,58,共5页
Materials For Mechanical Engineering
关键词
焊料
金属间化合物
时效
界面层
solder
intermetallic compound
aging
interface layer
