期刊文献+

Reactive Diffusion Bonding of SiCp/Al Composites by Insert Powder Layers with Eutectic Composition

Reactive Diffusion Bonding of SiCp/Al Composites by Insert Powder Layers with Eutectic Composition
下载PDF
导出
摘要 Mixed Al-Si and Al-Cu powders were investigated as insert layers to reactive diffusion bond SiCp/6063 metal matrix composite (MMC). The results show that SiCp/6063 MMC joints bonded by the insert layers of the mixed Al-Si and Al-Cu powders have a dense joining layer of high quality. The mass transfer between the bonded materials and insert layers during bonding leads to the hypoeutectic microstructure of the joining layers bonded by both the mixed Al-Si and Al-Cu powders with eutectic composition. At fixed bonding time (temperature), the shear strength of the joints by both insert layers of the mixed Al-Si and Al-Cu powders increases with increasing the bonding temperature (time), but get maxima at bonding temperature 600℃ (time 90 min). Mixed Al-Si and Al-Cu powders were investigated as insert layers to reactive diffusion bond SiCp/6063 metal matrix composite (MMC). The results show that SiCp/6063 MMC joints bonded by the insert layers of the mixed Al-Si and Al-Cu powders have a dense joining layer of high quality. The mass transfer between the bonded materials and insert layers during bonding leads to the hypoeutectic microstructure of the joining layers bonded by both the mixed Al-Si and Al-Cu powders with eutectic composition. At fixed bonding time (temperature), the shear strength of the joints by both insert layers of the mixed Al-Si and Al-Cu powders increases with increasing the bonding temperature (time), but get maxima at bonding temperature 600℃ (time 90 min).
出处 《Journal of Materials Science & Technology》 SCIE EI CAS CSCD 2005年第5期779-781,共3页 材料科学技术(英文版)
基金 the National Natural Science Foundation of China under grant No.50175004
关键词 Reactive diffusion bonding Insert powder layer SiCp/Al metal matrix composites Reactive diffusion bonding Insert powder layer SiCp/Al metal matrix composites
  • 相关文献

参考文献13

  • 1A.Urena, M.D.Escalera and L.Gil: Compos. Sci. Technol., 2000, 60, 613. 被引量:1
  • 2Maoai CHEN, Chuansong WU and Jianguo WANG:Trans. China Welding Inst., 2003, 24, 69. 被引量:1
  • 3P.P.Lean, L.Gil and A.Urena: J. Mater. Process. Technol., 2003, 143-144, 846. 被引量:1
  • 4R.Y.Huang, S.C.Chen and J.C.Huang: Metall. Mater.Trans. A, 2001, 32, 2575. 被引量:1
  • 5R.Gurler: J. Mater. Sci. Lett., 1998, 17, 1543. 被引量:1
  • 6T.J.Lienert, J.M.K.Wiezorek, H.L.Fraser and W.A.Baeslack: ASM Conference Proceedings: J. Adv.Spec. Mater., 1998, 117. 被引量:1
  • 7X.P.Zhang, L.Ye, Y.W. Mai, G.F.Quan and W.Wei: Compos. -Part A: Appl. S., 1999, 30, 1415. 被引量:1
  • 8M.J.Zhao, L.Q.Chen, J.Bi and G.Zhang: J. Mater. Sci.Technol., 2000, 16, 471. 被引量:1
  • 9X.P. Zhang, G.F.Quan and W.Wei: Compos. -Part A:Appl. S., 1999, 30, 823. 被引量:1
  • 10A.Urena, M.D.Escalera and M.I.Femandez: Weld. J.,2997, 76, 92. 被引量:1

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部