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HCl/HF/CrO_3溶液对InGaAs/InGaAsP的选择性湿法刻蚀——应用于楔形结构的制备

Selective Wet Etching of InGaAs/InGaAsP in HCl/HF/CrO_3 Solutions:Application to Vertical Taper Structures
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摘要 利用动态掩膜湿法腐蚀技术,研究了HCl/HF/CrO3溶液对与InP衬底晶格匹配的InxGa1-xAs1-yPy(y=0,0.2,0.4,0.6)材料的腐蚀特性.对于HCl(36wt%)/HF(40wt%)/CrO3(10wt%)的体积比为x∶0.5∶1的溶液,随着x由0增加到1.25,相应的腐蚀液对In0.53Ga0.47As/In0.72Ga0.28As0.6P0.4的选择性由42.4降到1.4;通过调节腐蚀液的选择性,在In0.72Ga0.28As0.6P0.4外延层上制备出了倾角从1.35°到35.9°的各种楔形结构;当x为0.025和1.25时,相应的In0.72Ga0.28As0.6P0.4腐蚀表面的均方根粗糙度分别为1.1nm和1.6nm.还研究了溶液的组分与InxGa1-xAs1-yPy(y=0,0.2,0.4)的腐蚀速率间的关系,并对腐蚀机理进行了分析. The etching characteristics of InxGa1-xAs1-yPy(y=0,0.2,0.4,0.6), lattice matched to InP substrate,were studied using the dynamic etch mask technique. For solutions with HCl(36wt%) : HF(40wt%) : CrO3(10wt%) volume ratio of x :0.5 : 1 ,the selectivity decreases from 42.4 to 1.4 for In0.53 Gao0. 47 As/In0. 72 Ga0. 28 As0. 6 P0.4 with HCl/CrO3 volume ratio x increasing from 0 to 1.25. The selective etching was experimentally applied to fabricate vertical taper structures with angles ranging from 1.35° to 35.9° on the Ir0.72Ga0. 28As0.6P0. 4 epitaxial layer. Surface roughness of the etched taper is less than 1.6nm.
出处 《Journal of Semiconductors》 EI CAS CSCD 北大核心 2005年第7期1469-1474,共6页 半导体学报(英文版)
基金 国家自然科学基金重大项目(批准号:90201035) 国家高技术研究发展计划(批准号:2003AA312020) 国家重点基础研究发展计划(批准号:2003CB314901)资助项目~~
关键词 半导体器件 制造工艺 楔形结构 动态掩膜湿法腐蚀技术 刻蚀 选择性湿法 HCl/HF/CrO3溶液 INGAASP INGAAS dynamic etch mask selective etching wet chemical etching vertical taper structures InGaAsP
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参考文献14

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