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时延驱动的VLSI版图规划算法 被引量:2

Timing Driven Floorplanning
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摘要 本文提出了时延驱动布图规划(TimingDrivenFloorplanning)的思想。在用改进的广义力矢量法优化功能单元间连线时延的同时,运用非线性规划的方法进一步优化关键路径上功能单元的时延及连线时延,结果表明,这是一种有效的优化版图时延的方法。 In this paper,we present the idea of timing driven floorplanning.While optimizing the interconnection delay between cells using improved GFDR,We use nonlinear programming method to reduce the cell delays and interconnection delays in critical paths.The result shows that it is an effective method for optimizing layout delay of VLSI.
出处 《电子学报》 EI CAS CSCD 北大核心 1995年第2期103-105,共3页 Acta Electronica Sinica
基金 国家"八.五"重点科技攻关项目
关键词 VLSI 集成电路 时延驱动布图 布图规划 VLSI,Timing driven layout,Floorplanning
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同被引文献23

  • 1严晓浪,戚肖宁,金玲.一种时延驱动的VLSI布局方法[J].电子学报,1993,21(2):28-33. 被引量:1
  • 2冯之雁,戚肖宁,严晓浪.VLSI版图综合中的P/G网实体优化布线[J].微电子学与计算机,1994,11(4):1-4. 被引量:1
  • 3J Cong, W Jie, Y Zhang. A thermal-driven floorplan for 3D-ICs [ A]. Proc. Int. Conf. Comput.-Aided Des[ C ]. San Jose, CA, USA, 2004.306 - 313. 被引量:1
  • 4W-L Hung,G M Link,Y Xie,N Vijaykrishnan, M J Irwin. In- terconnect and thermalaware floorplan-ning for 3D micropro- cessors[ A]. Proc. Int. Syrup. Quality of Electronic Design[ C]. San Jose,CA,USA,Mar.2006.98- 104. 被引量:1
  • 5P-Q Zhou, Y-C Ma, Z-Y Li, R P Dick, S Li, H Zhou, X-L Hong, Q Zhou. 3D-STAF: Scalable temperature and leakage aware floorplanning for three-dimensional integrated circuits [ A]. Proc. Int. Conf. Comput. -Aided Des [ C ]. San Jose, CA, USA, 2007.590 - 597. 被引量:1
  • 6X Li, Y Ma, X Hong, S Dong, J Cong. LP based white space redistribution for thermal via planning and performance opti- mization in 3D ICs[ A]. Proc. Asia South Pacific Des. Autom. Conf[ C]. Seoul, Korea, 2008.209 - 212. 被引量:1
  • 7Yun Huang, Qiang Zhou, Yici Cai.A thermal-driven force-di- rected floorplan-ning algorithm for 3D ICs[ A]. International Conference on Computer Aided Design and Computer Graph- ics[ C]. Huangshan, China, 2009.497 - 502. 被引量:1
  • 8B Goplen, S Sapatnekar. Efficient thermal placement of stan- dard cells in 3D ICs using a force directed approach [A ]. Proc. Int. Conf. Comput.-Aided Des [ C ]. San Jose, CA, USA. ,Nov.2003.86- 90. 被引量:1
  • 9J Li,H Miyashita.Post-placement thermal via planning for 3D integrated circuit [ A ]. Proc. Asia Pacific Conf. Circuits Syst C]. Singapore, 2006.808 - 811. 被引量:1
  • 10J Cong, G-J Luo, J Wei, Y Zlaang. Thermal-aware 3D IC placement via transformation [ A ]. Proc. Asia South Pacific Des. Autom. Conf[ C]. Yokoha-ma, Japan, 2007.780 - 785. 被引量:1

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