摘要
研究了用复合电沉积法制备ＳｉＣ_ｐ／Ｃｕ复合材料的工艺。结果表明，用复合电沉积法制备颗粒增强金属基复合材料是一种切实可行的方法。当镀液中ＳｉＣ颗粒含量为１５ｇ／１，电流密度为４Ａ／ｄｍ￣２，电镀温度１５～２０℃，板泵搅拌时，可获得含有２０ｖｏｌ％ＳｉＣ_ｐ的ＳｉＣ_ｐ／Ｃｕ复合材料。
he processing of SiC_p/Cu compoite by compeite plating has been investigated, The results show that it is available that the particle-reinforced com poite is preduced by the method of compcsite plating.The 20vol%SiC_p/Cu compossite can be obtained in the case of 15%SiC concentration in the plating bath,4A/dm￣2 and 15～20℃。
出处
《材料工程》
EI
CAS
CSCD
北大核心
1995年第10期23-25,共3页
Journal of Materials Engineering
关键词
铜基
复合材料
复合电沉积
碳化硅
SiC_p,copper-matrix composite,compossite plating
