摘要
叙述了聚合物绝缘材料漏电起痕的形成机理,聚合物绝缘材料的结构对漏电起痕的影响进行了分析,含有共轭双键,苯核,杂环的聚合物绝缘材料耐漏电起痕差。对国内常用聚合物绝缘材料耐漏电起痕性能作了评价,为了提高耐漏电起痕性,除了使用不含或少含共轭双键结构的聚合物外,可加入适量的氢氧化铝。
This paper describes the mechanism of forming track in polymeric insulating materials and analyses the influence of polymer structure on tracking.The result shows that the polymer containing benzene ring,conjugated double bond or heterocyclic is prone to forming track.The tracking resistibilities of common polymeric insulating materials using in our country are evaluated.Besides using non or little benzene ring polymer,some aluminum hydroxide should be added to enhance the tracking resistance.
出处
《绝缘材料》
CAS
2005年第3期48-51,共4页
Insulating Materials