摘要
倒装芯片与传统的引线键合封装技术相比较,可以拥有许多的优点,其中包括优异的导热性能和电性能、可以具有众多的IO接点、非常灵活地满足各种各样性能的基层、很好地利用现有的工艺技术、利用现有的基础装备,以及降低器件的外形尺寸。
Flip-chip offers a variety of benefits compared with traditional wire-bond packaging, including superior thermal and electrical performance, the highest I/O capability, substrate flexibility for varying performance requirements, well-established process equipment expertise, proven construction, and reduced form factors.
出处
《电子工业专用设备》
2005年第7期7-10,共4页
Equipment for Electronic Products Manufacturing
关键词
倒装芯片
封装技术
芯籽
Flip-chip
Packaging technology
Die
