摘要
由于MCM自身的特点,物理设计已成其瓶颈问题。本文在已有方案的基础上,设计实现了一个数字显示电路,并计算了各单元电路的相关参数,最后对电路进行多芯片组件(MCM)封装。仿真结果表明,该电路的最大电容量和响应时间等参数均能满足电路设计的要求。
Physical design has become a bottleneck problem because of the features of multichip modules (MCMs). Based on the existing design method, a capacitor digital metrical circuit is produced through improving the counting control circuit and calculating the related circuit parameters. MCM package is applied in circuit in order to realize higher package density and work frequency. The MCM packaging simulation results show that the maximum measurable capacitance and response time can meet the practical requirements.
出处
《电路与系统学报》
CSCD
北大核心
2005年第3期129-131,共3页
Journal of Circuits and Systems
基金
国防预研基金项目(41323020204)
关键词
多芯片组件
封装
仿真
multichip module (MCM)
packaging
simulation
