摘要
结合典型的焊料键合MEMS真空封装工艺,应用真空物理的相关理论,建立了封装腔体的真空度与气体吸附和解吸、气体的渗透、材料的蒸气压、气体通过小孔的流动等的数学模型,确定了其数值模拟的算法.通过实验初步验证了模拟结果的准确性,分析了毛细孔尺寸对腔体和烘箱真空度的影响,实现了MEMS器件真空封装工艺的参数化建模与模拟和仿真优化设计.
By applying vacuum physics to typical solder-bon ding vacuum packaging process of MEMS devices,the mathematical and physical model between vacuum degree of cavity to be packaged and gas absorption and desorption,gas penetration,gas flowage through little hole,and steam pressure of materials is established and its arithmetic is ascertained with numerical simulation method.The veracity of the simulation results is validated by experiments and the effect of the size of capillary hole on vacuum degree is analyzed.The parametrical modeling,simulation,and optimization design of vacuum package process of MEMS devices are realized.
基金
国家高技术研究发展计划资助项目(批准号:2003AA40415)~~
关键词
MEMS
真空
封装
模拟
MEMS
vacuum
packaging
simulation
