摘要
研究了固溶时效和快速凝固时效对Cu Cr Sn Zn合金的微观组织、硬度和导电率性能的影响。结果表明,快速凝固态下合金的晶粒比固溶态时的晶粒要细小得多,细晶强化作用显著;合金快速凝固时效后的析出相较固溶时效的析出相更加弥散、稠密,使合金强度得以提高。合金经920℃×1h固溶和500℃×15min时效后,硬度为102HV,导电率达50%IACS;而快速凝固的合金在同样的时效条件下,硬度为179HV,导电率达60%IACS。
The effects of different solution processes on microstructure and properties of the aged Cu-Cr-Sn-Zn alloy were researched. The results show that the grain size of rapid solidification sample is much smaller than that of the solution treatment one, also there are much finer precipitates in the rapidly solidified aged sample than in the solution aged one, so the strength of this alloy is enhanced obviously under rapid solidification aging than solution aging. Under the condition of solution treatment at 920°C for 1 h and aging at 500°C for 15 min, the hardness and electrical conductivity of this alloy can reach 102 HV and 50% IACS respectively, however they can reach 179 HV and 60% IACS respectively under rapid solidification and the same aging condition.
出处
《金属热处理》
EI
CAS
CSCD
北大核心
2005年第5期49-52,共4页
Heat Treatment of Metals
基金
国家高技术研究发展计划(863计划)(2002AA331112)
西北工业大学博士论文创新基金
河南科技大学科研基金(2004zy039)
