摘要
在已有各种工艺因素对电解涂硅量影响研究的基础上,对在高电流密度(100~200A/dm2)及短时间(0.1s)电解条件下电解涂覆薄层(纳米量级)SiO2机理进行了初步研究,实验模拟了实际生产中采用的中间导体法,并运用多种测试方法对电解涂硅的机理进行了分析探讨,揭示了高电流密度下电解脱脂涂硅的吸附本质及SiO2在钢板表面的空间分布,并就钢板阴阳极两面涂硅量的不同原因进行了解释。
Based on the study of the various processing factors that influence the amounts of silicon on the steel surface, the mechanism of the electrodeposition of nano scale silica thin film at the condition of high current density (100~200 A/dm^2) and short time (0.1 s) was investigated. The bipolar electrolytic method used in practice production was simulated and some surface test methods was used to study the process of electrodepostion of silica on the steel. The adsorption qualities of the electrodeposition of silica and the space distribution of silica on the steel plate at the condition of high current density were revealed. In addition, the possible reason of the different amounts of silica on the two opposite electrode surfaces of the steel was discussed.
出处
《电镀与精饰》
CAS
2005年第3期5-7,共3页
Plating & Finishing