摘要
提出了一种新型多晶硅薄膜热膨胀系数的在线测试结构.给出了热电机械耦合模型和测试方法、结构参数设计的优化方案及误差分析,并利用ANSYS软件进行模拟.该结构测量方便,独立性较高,误差较小,用电学量形式输出,对于薄膜热膨胀系数的在线检测有较高的参考价值.
This paper presents a novel structure for in situ determining thermal expansion coefficient of polysilicon thin films.A thermal-electro-mechanical compliant model is provided and confirmed with ANSYS software and some optimized parameters are also achieved through simulations.The structure has many advantages such as high precision without any particular requirements (vacuum or sealed chamber).Furthermore,the results of test are all presented in electrical form.
基金
国家高技术研究发展计划资助项目(批准号:2002AA404010)~~
关键词
MEMS
多晶硅
热膨胀系数
在线检测
MEMS
polysilicon
thermal expansion coefficient
in situ measure
