摘要
准LIGA加工工艺通常只能加工单层准三维体。本研究采用SU 8胶准LIGA技术,解决了多层套刻、种子层和表面活化等技术难题,加工出了三维五层一体化复杂结构。实践证明,所提出的工艺实际可行,进一步拓展了准LIGA工艺的应用。
UV-LIGA process is conventionally used for 2.5 dimensions and single layer structure. Using SU-8 based UV-LIGA and overcoming difficulties in overlap of multiple layers, difficulties in seed layer technology as well as difficulties in surface activation, we fabricated a 3-dimension and 5-layer structure. The process given here is proved to be practical and it expands the application of UV-LIGA.
出处
《微细加工技术》
EI
2005年第1期75-78,共4页
Microfabrication Technology
基金
国家863计划资助项目(2003AA404210)