摘要
着重叙述了缓冲剂原理及应用。详细阐述了在电镀工艺中如何选用缓冲剂以及将电镀中的缓冲剂与化学中的缓冲剂的应用加以区别。
The buffering principle and application of buffering agent were introduced. The screening of
buffering agent in electroplating process was introduced in detail. The difference of the applica-
tion of buffering agent in electroplating industries from the one in chemistry was discussed.
出处
《表面技术》
EI
CAS
CSCD
1994年第4期176-179,共4页
Surface Technology
关键词
缓冲剂
电镀
buffering agent, electroplating, application
