摘要
微波焊接技术近年来发展较快,它有下列优点:1)能耗低;2)升温速度快;3)接头质量高等。本文研究了Bi系超导材料微波焊接的可行性。结果表明,经855℃60h热处理后,焊接试样的T_c可达107K,与焊接前试样的T_c一致,焊区强度已经高于基体。利用电子探针对焊接前后的显微结构进行了比较,发现焊区组织致密,但在后处理过程中发生再结晶,导致焊区晶粒较大,焊缝变宽且焊区内存在较多杂相。
Microwave joining developed rapidly in recent years, because of its advantages such as 1)low energy consnmption; 2)rapid heating rate; 3)high quality joint. Microwave joining of the Bi-based 2223 superconductor was studied with the results showing, after joining at 900-1000℃ for 10 minutes and post treatment at 855℃ for 60 hours, T_c restored to 107 K, the same as that of the original sample. Electron probe technique was used to study the mi-crostructure features before and after joining.
出处
《物理学报》
SCIE
EI
CAS
CSCD
北大核心
1993年第7期1167-1171,T002,共6页
Acta Physica Sinica
基金
中国科学院高性能陶瓷
超微结构开放研究实验室资助的课题
