摘要
本文在实验与分析的基础上,建立了表面组装激光低温钎焊接合部温度场数值计算模型,考虑了钎料的热物理性质变化、激光的实际能量分布和在钎焊材料表面的反射损失以及表面散热对热过程的影响,试验验证了该模型的正确性。
In this paper, a numerical simulation of thermal process on the SMT laser microsoldering joint has been developed, in which, the influence on thermal process of the factors such as the thermal conductivity, variation of solder with temperature, light reflection coefficient of the lead wire surface, and heat exchange on the surface of SMT materials have all been considered. In order to carry this numerical calculation practice and prove it' s results, the reflexive characteristic of light wave to the SMT materials has been gauged temperature process of laser microjoint has been measured.
出处
《中国激光》
EI
CAS
CSCD
北大核心
1993年第2期126-131,共6页
Chinese Journal of Lasers
基金
国家自然科学基金资助
关键词
数值模型
表面组装技术
激光焊
SMT
laser microsoldering, thermal process, numerical calculation, surface mount technolohy(SMT)
