摘要
该文简要介绍了环境试验中温度、湿度应力在电气·电子产品使用中影响可靠性的基本原理,比较了高温试验、湿热试验、冷热冲击试验对电子元器件、印制电路板等材料的不同影响情况,分析介绍了塑封半导体器件腐蚀、印刷电路板离子迁移、印刷电路板焊接龟裂的失效机理。
This paper briefly introduces the fundamental principle of temperature and moisture stress in the use of electrical & electronic products which influence the reliability in environmental experimentations, it also compares the different effects of high-temperature test, humid heat test and cold/hot blow test towards electronic components, PCBs and other materials. Finally, it analyzes the failure mechanism of the erosion of plastic-packaged components, the ionic migration of PCBs and the solder chap of PCBs.
出处
《印制电路信息》
2005年第2期14-20,41,共8页
Printed Circuit Information
