摘要
湿法贴膜技术对于贴膜产能的提高十分明显;良率方面, 湿法贴膜可以很好的解决由于贴膜不良等造成的干膜结合不良。为什么湿法贴膜能克服表面的凹陷和铜瘤?如何在大量生产前去比较和验证填覆能力的差异是大家共同关注的问题,本文系统介绍了一种实用的测试理念和方法,以供同行参考。
wet lamination demenstrates its advantage on the lamination productivity while show good conforma-tion to cope with the dry film adhesion issue. That why ? and how to determine or test its advantage on the conforma-tion becomes a hot topic for the PCB experter,A practiced test concept and method will be introduced in this paper.
出处
《印制电路信息》
2004年第12期29-30,共2页
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