摘要
微流控分析芯片制作方法的研究是微流控分析的基础。制作性能良好的微流控分析芯片时,基片与盖片的键合技术十分重要。本文针对近年来发展迅速的低温键合技术,对各种方法进行了评价,并对其发展前景进行了展望。
The research of fabrication methods for microfluidic analysis chip is the base of microfluidic analysis. The bonding of base plate with cover plate is of great importance in the fabrication of microfluidic chips with good performance. The low temperature bonding technologies developed recently were reviewed. Some kinds of methods for low temperature bonding were evalua-ted and their prospect was mentioned.
出处
《微纳电子技术》
CAS
2004年第11期7-11,共5页
Micronanoelectronic Technology
基金
国家自然科学基金资助项目(20375051)
