摘要
固体界面热阻是航空航天、低温与超导、微电子技术等领域中关注解决的基本科学问题 ,氮化铝陶瓷和金属铜被广泛应用于低温超导装置和集成电路芯片。该文基于氮化铝陶瓷与金属铜样品之间界面热阻的低温实验 ,应用MATLAB软件对实验数据进行回归分析 ,建立了氮化铝陶瓷与铜之间界面热阻与温度、压力等参数的回归分析仿真模型 ,仿真结果与实验数据有较好的一致性。该文研究结果对氮化铝陶瓷、铜应用于超导装置和集成电路芯片的传热设计。
The interface thermal resistance is the basic science problem in the fields of cryogenics, aerospace, superconducting and microelectronic technology etc. The AlN(ceramic material) and copper have been widely used in the cryogenic superconducting devices and integrated circuit chips. Based on the low temperature experiment of interface thermal resistance between AlN ceramic and copper, the simulation model of interface thermal resistance between AlN and copper has been built according to the regression analyses by applying Matlab software. The simulation results are in reasonable agreement with the cryogenic experiment data of interface thermal resistance. The investigation results are significant for the aerospace thermal control, design of heat transfer of the AlN ceramic and Cu in the application of the cryogenic superconducting devices and integrated circuit chips.
出处
《计算机仿真》
CSCD
2004年第11期33-35,共3页
Computer Simulation
基金
国家自然科学基金资助项目 ( 5 10 760 13 )
关键词
界面热阻
回归分析
仿真
氮化铝
铜
Interface thermal resistance
Regression analyses
Simulation
AlN
Copper
