摘要
研究了在 AlN 多层布线共烧基板中,W-SiO_2浆料体系中 SiO_2含量对共烧基板烧结性能的影响。结果表明 SiO_2的质量分数在0.45％时,AlN 多层布线共烧基板的导带方阻达到10moΩ/□,基板的翘曲度小于50μm/50mm。
Aluminum nitride(AlN)co-fire multiplayer ceramic substrate has been widely used in high-densi-ty electronic package.A tungsten paste is proposed with SiO_2 glass as the additive for co-fire multi-layer ceramic sub-strate.If 0.45wt% SiO_2 concentration is added in the paste,the sheet resistivity is 10mΩ/□,substrate bending issmaller than 50μm/50mm.
出处
《材料导报》
EI
CAS
CSCD
2004年第6期88-90,共3页
Materials Reports
基金
信息产业部电子科学研究院预研课题(30.2.2.5-1)
关键词
氮化铝
多层共烧
导带浆料
烧结性能
集成电路
aluminum nitride
co-fire multi-layer ceramic substrate
conductive paste
