摘要
本文论述了四级微型半导体致冷器与红外探测器金属杜瓦瓶的钎焊方法。实验证明:预先在致冷器底面和杜瓦瓶底座挂上钎料,采用钎剂和保护气体加热钎焊,可降低加热温度,提高钎焊质量;采用快速冷却可大大减小由于长时间热滞所导致致冷器性能的下降,从而为半导体致冷的红外探测器提供了最佳的组装方法和实验参考。
This paper deals with method of soldering thermoelectric cooler with metal dewar of infrared detector. Experiments show that the quality of soldering can be improved by using soldering paste and protected gas to heat soldering,putting up the solder beforehead on solderred feces. It greatly reduces the drop of the cooler property by means of fast cooling method. Thus it provides the infrared detector (?)oied by thermoelectric cooler with optimum combination method.
出处
《激光与红外》
CAS
CSCD
北大核心
1993年第4期40-41,57,共3页
Laser & Infrared
关键词
致冷器
红外探测器
钎焊
焊接
thermoelectric cooler, IR detector, soldering
