摘要
为了探讨微波电路装配过程中的微带电路基板接地方法对微波电路性能影响情况,先通过对接地缺陷的影响结果的仿真分析,再用实验手段验证了仿真分析结果的正确性;并对微波部件采用接触式微件焊接技术进行大面积接地焊接的方法进行了研究和分析,采用大面积接地焊接的工艺方法,低温焊接实验的结果是可行的。
The performance of microwave circuit is largely effected by the methods of assembly,especially by the method of grounding. In this article,the defected grounding model is analyzed.The effects of large-area grounding methods on microwave circuit are derived and proposed,and then the results of analysis are validated by the experiment.The processing design and experiment results of the large-area grounding were introduced.
出处
《信息与电子工程》
2004年第3期209-212,218,共5页
information and electronic engineering
关键词
电子技术
接地技术
组装
微波电路
electronic technology
grounding technology
assembly processes
microwave circuit
