摘要
在文献[1]所建立的C/Al复合材料界面反应动力学的基础上,利用扫描俄歇微探针深度分析测量了不同退火工艺的模拟C/Al-Ti和C/Al-Cu样品界面反应层的厚度,求得相应的界面反应激活能,并确定了界面反应从慢到快的顺序为C/Al-Ti、C/Al-Cu和C/Al。
Based on the kinetics of interfacial reaction in C/A1 composi-te materials established in reference [1], the kinetics of interfacial reac-tion zone is measured by Scanning Auger Microprobe Depth Profile for simulated C/Al-Ti and C/Al-Cu specimens subjected to various annealing procedures. The activation energy of interfacial reaction is ordered increas-ingly as C/Al-Ti, C/Al-Cu and C/A1.
出处
《复合材料学报》
EI
CAS
CSCD
北大核心
1993年第3期63-67,共5页
Acta Materiae Compositae Sinica
关键词
界面反应
复合材料
钛
铝
碳纤维
interfacial reaction, kinetics, activation energy, Scanning Auger Microprobe
