摘要
针对三种不同的图像边缘增强方法进行了掩模和硅片识别精度以及对准精度的实验验证。采用一种新的测试方法,即先通过软件得到大量的数据,然后再进行数据分析,得出LAPLAC算子在识别精度和对准精度两个方面比较好,而改进后的SOBELII算子的对准时间最短,对准精度也很高。
Three different methods of edge-enhanced image are proposed to measure mask and wafer placement and alignment accuracies.A novel measuring method is adopted: getting lots of data through the programmed software firstly,then analyzing the obtained data.The analyzing results show that LAPLAC operator is better than the others according to placement and alignment accuracies,but the revised SOBEL II operator is the best method of the alignment accuracy,and it has the shortest aligning time and the highest alignment accuracy.
出处
《微细加工技术》
2004年第2期17-22,共6页
Microfabrication Technology
关键词
X射线光刻
对准系统
拉普拉斯算子
识别精度
对准精度
X-ray lithography
alignment system
LAPLAC operator
placement accuracy
alignment accuracy
