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正畸托槽去除后两种釉质抛光法对比研究——釉质扫描电镜观察 被引量:6

Comparison of two means for enamel polishing after debonding——observation of enamel surface under SEM
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摘要 目的 :观察去除黏结后釉质表面不同处理方法对牙齿表面结构的影响 ,为临床提供一种新的釉质抛光方法。方法 :选择因正畸治疗需拔除 4个第一前磨牙的患者 8例 ,共 32个牙。不同的个体 ,按同名牙分成 4组 ,每组 8个 ,分别用常规的方法和釉质处理仪进行牙面抛光处理 ,同时记录抛光时间 ,拔除后 ,测量其表面粗糙度Ra ,然后扫描电镜观察。结果 :正畸过程中釉质组织结构有变化 ,釉质处理仪抛光牙面优于常规方法 ,Ra值釉质处理仪组可以达到常规组的抛光效果 ,且效率提高。结论 :釉质处理仪对牙表面的处理结果可以达到临床要求。 AIM:To observe the enamel surface after acid etching and removal of bonding adhensive under SEM.METHODS:Thirty two premolars which would be extracted orthodontically,from 8 adults were divided into 4 groups.Make sure that each group was comprised of 8 premolars of same quadrant.Two groups were polished by traditional mothods,while the other groups were polished by the grinding instrument devised by us,and the polishing-time was recorded.When the premolars were extracted and the roughness of emanel surface was evaluated,then observed under SEM.RESULTS:The enamel surfaces appeared some form of abrasion after acid ecthing and bonding adhensive removal. Under SEM,we found that the enamel surfaces of the groups treated by grinding instrument were better than that of the groups with traditional methods,and the Ra of former was comparable to that of the latter.With the grinding instrument,more efficiency was gotten.CONCLUSION:The grinding instrument could provides the standard reguirement for enamel polishing clinically.
出处 《牙体牙髓牙周病学杂志》 CAS 2004年第6期319-321,共3页 Chinese Journal of Conservative Dentistry
关键词 釉质 抛光 电子显微镜 表向粗糙度 enamel polishing SEM roughness
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参考文献7

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