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正交法对DEM技术中模压工艺的优化研究 被引量:1

Optimization for Hot Embossing Process Parameters in DEM Technique by Orthogonal Experiment
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摘要 DEM(Deepetching,Electroforming,Microreplication)技术是一种三维微细加工技术,由深刻蚀、微电铸和微复制三种工艺组成。其中微复制常采用模压工艺,而模压工艺具有许多参数,为了确定主要影响因素和最佳工艺条件,首次用正交实验方法对模压工艺进行优化。用镍模具对聚碳酸酯(PC)进行模压,得到影响因素主次为:模压温度>施加压力>加力速度>加力时间,优化参数为:模压温度180℃,压力3000N,加压速度0 2mm/min,力维持时间120s。用得到的优化参数进行实验得到了最佳的实验结果,由此证明了此方法的可行性。 DEM technique is a three-dimensional micro fabrication technique including three steps: deepetching, electroforming and microreplication. The common method used in the step of microreplication is hot embossing, which has many parameters. In order to find the major factors and optimized parameters, orthogonal method was employed in the experiments. A Ni mold was made to hot emboss PC (polycarbonate)sheet. The major factors in order of importance are: embossing temperature>embossing force>velocity of pressing>time of loading and the optimized parameters are as follows, temperature 180 ℃, force 3 000 N, velocity 0.2 mm/min and time (120 s.)Using these parameters to do the experiment and the best result was obtained, which demonstrated the feasibility of this method.
出处 《微细加工技术》 2004年第3期45-49,共5页 Microfabrication Technology
基金 国家863MEMS重大专项资助项目(2002AA404150) 上海市科委重大项目资助(02dz11020)
关键词 DEM技术 模压 微复制 正交实验 DEM technique hot embossing microreplication orthogonal experiment
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