摘要
激光/红外印制电路板焊点检测系统,是80年代中期出现的世界上最先进的焊点质量检测手段,其检测速度、检测精度、检测可靠性和重复性、自动化程度,都是人工目视等其它方法远远不可比拟的。笔者对大量试验结果进行分析,可以认为:焊点激光红外检测数据、润湿角大小、焊点外形及抗拉强度数值、焊料重量值和合金层,可以作为判断焊点合格与否的标准。
Testing system using laser/infrared for soldering points in PCB's is the most advanced soldering points testing system appeared in the world in mid 1980's. It is uncomparable with regard to testing speed, accuracy, reliability and degree of automation and far better than any other means of testing such as visual observation. A lot of testing results have been analysed by the author and it is believed that data obtained by means of laser/infrared testing, such as wet angle, outter appearence, tension resistance, weight of soldering material and thickness of alloy layer, may be used as critera for the acceptance of soldering points.
出处
《电视技术》
北大核心
1993年第12期36-38,共3页
Video Engineering
关键词
激光/红外
彩色电视
焊接
检测
PCB soldering points Laser/infrared Wet angle
