摘要
我国自行制造电子标签用的集成电路芯片是一件与降低成本、促进应用息息相关的大问题。本文在介绍电子标签的市场发展状况、应用领域、芯片制造与封装等关键技术之后,记述了在UH F频段的电子标签的技术壁垒面前,应该如何逾越壁垒、加强自主创新,去迎接RFID大规模应用前景时的设想和实践。
It's a big problem for China to produce integrated circuit CMOS chip that used in electric tag in order to reduce the cost and promote its application. In this article, after introducing the development situation of market, application field, CMOS chip manufacture and encapsulation technologies about the electric tag, it presents how to overcome the barriers and enhance the innovation to welcome the application of RFID on large scale in front of the technical barriers of electric tag in UHF.
关键词
RFID应用
技术
UHF
发展和展望
Application of RFID
Technology
UHF
Development and Expectation