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刚挠结合板激光加工工艺研究 被引量:4

A Study of Laser Process to RF PCB
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摘要 刚挠结合板是近几年PCB行业重点发展的新产品,广泛应用于航空航天、医疗、高端电子产品。作为目前PCB行业中利润最高的产品,全球众多的在PCB行业有重大影响力的PCB制造商都在积极地研发和制造相关产品。然而,由于其与普通的硬板绝然不同的结构,在制造工艺上也存在着不同的地方,特别是有些传统的制作工艺难以解决的问题,也阻碍了它的进一步发展。激光作为一种新型的加工工具,特别是进入21世纪以来,在各行各业都得到了广泛的应用。近来,在PCB设备厂商的积极研发及推动下,激光在PCB行业的应用也越来越广泛。在刚挠结合板的制作中,开盖和外形成型一直是制造过程中的难点,而激光基于自身的特点,在这些制程中相比传统机械加工方式有许多优点,如高效率、高精度、高良品率、挠性便捷的加工方式等。另外,在R-Flex板的制作中,激光还可加工P/P料的异型槽孔。本文将对激光在R-Flex板的制作中的这些应用最前沿的研究成果进行总结和阐述,相信在这些技术的推动下,刚挠结合板一定能够得到更快速的发展和更广泛的应用。 R-Flex PCB as a new product in the industry is widely used in aviation,medical and high end electronic products.The major players in PCB industry are actively developing and manufacturing the related products driven by the highest profit margin.The obstacle in front of the evolution is the new process and the special structure different from traditional hard PCB.Laser as a new tool,especially in 21st century,is widely used in all industry.Recently,with the supporting of the PCB equipment manufacturer, laser is become more and more popular in PCB industry.In the R-flex PCB manufacturing,decapsulation and the edge forming is the most difficult process,laser compare with traditional manufacturing process has a quantity of advantage.For example,the efficiency,the precision,yield rate and flexibility.Laser is also capable to create customize shape in R-Flex PCB.In this paper,the author described the front end study result of R-Flex PCB.The author believes that driven by the new technology,The progress of revolution and application of R-Flex PCB will be accelerate.
作者 雷群
出处 《印制电路信息》 2009年第S1期140-146,共7页 Printed Circuit Information
关键词 激光 印刷电路板 刚挠结合板 开盖 Laser PCB R-Flex board Decapsulation
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