摘要
通过电镀金刚石线锯在超声振动下切割多晶硅的实验,研究了工艺参数对材料去除率的影响,建立了单颗金刚石磨粒材料去除模型,分析了金刚石粒度、静压力和线速度与材料去除率的关系。分析表明:基于超声波线锯切削条件下,适当提高金刚石粒度、静压力和线速度有利于提高材料去除率。施加超声振动后金刚石锯切加工效率平均提高1～2.5倍。
Polysilicon slices were cut with electroplated diamond wire saw under ultrasonic vibration.Influences of several process parameters on the material removal rate,including diamond grit size,ultrasonic pressure and line speed,were studied.The contact model of the single diamond grain was established.Results showed that a high removal rate could be obtained by increasing diamond grit size,static pressure or line speed.With ultrasonic vibration,the cutting efficiency could be increased by an average of 1 to 2.5 times.
出处
《金刚石与磨料磨具工程》
CAS
2013年第1期65-69,共5页
Diamond & Abrasives Engineering
基金
辽宁省科技创新团队项目资助
关键词
多晶硅片
超声波加工
金刚石线锯
材料去除率
polysilicon slices
ultrasonic machining
diamond wire saw
material removal rate
