摘要
结合剪切干涉技术与显微干涉技术 ,提出了显微剪切干涉非接触表面粗糙度轮廓测量方法 .由于自参考干涉和共路偏振相移干涉特点 ,建议的干涉仪具有极好的抗环境干扰和振动的能力 ,同时能取得一般显微干涉仪的表面粗糙度测量精度 ,适合制造环境下表面粗糙度精密测量 .介绍了发展的显微剪切干涉仪的原理 ,以及相应于粗糙度轮廓的波前重建算法 .
Combining the shearing interference technique with microscope interference technique, we proposed a shearing microscope interferometry for the measurement of surface roughness profile. Due to the characteristics of self reference ad common path polarized phase shifting, the proposed interferometry possessed anti vibration and anti disturbance from environment and had similar accuracy to general interferometry for surface roughness measurement. It was suitable for roughness measurement in manufacturing environment. The basic measurement principle and wave front recovery algorithm corresponding to roughness profile were introduced. The experimental result proved the feasibility of the interferometry.
出处
《华中科技大学学报（自然科学版）》
EI
CAS
CSCD
北大核心
2004年第7期70-71,74,共3页
Journal of Huazhong University of Science and Technology(Natural Science Edition)
基金
国家自然科学基金资助项目 (5 9975 0 35 )
关键词
粗糙度
剪切干涉
显微干涉
抗振
roughness profile
shearing interference
microscope interference
anti vibration
