摘要
本文介绍了深亚微米工艺用二次超纯水系统主要工艺流程及其各部分的作用。比较了一次纯水电阻率,二次纯水电阻率及二次纯水 TOC 含量的相互关系。讨论了半导体集成电路制造工艺对超纯水的水质要求以及水中杂质对半导体工艺的影响。
The main process flow of a 2nd pure water system for deep submicron processes and the functions of the various parts of the system are desribed.Comparisons are made between the resistivity of 1st pure water, resistivity of 2nd Pure water and TOC content of 2nd pure water,Requirements of semiconductor IC fabrication processes for the quality of ultropure water on semiconductor processes are discussed.
出处
《电子与封装》
2002年第2期38-44,共7页
Electronics & Packaging
关键词
深亚微米
一次纯水
二次纯水
Deep submicron
1st pure water
2nd pure water
