摘要
采用反应磁控溅射法在室温下沉积前驱体氮化物,在大气环境、500℃下氧化退火30min后获得了Al-N共掺杂ZnO:Mn薄膜。研究了直流与射频反应磁控溅射对氧化退火薄膜结构和性能的影响。结果表明:两种工艺制备的退火薄膜均具有ZnO纤锌矿结构,且均为n型导电。射频溅射退火样品具有很好的c-轴择优取向,其表面光滑平整,表面粗糙度RMS值为1.2nm,且具有室温铁磁性,饱和磁化强度(Ms)和矫顽力(Hc)分别为46.8A·m–1和4.9×103A·m–1;而直流溅射退火样品表面凹凸不平,RMS值为25.8nm,室温下是反铁磁性的。
Al-N co-doped ZnO:Mn thin films were fabricated by oxidative annealing nitride precursors, which were deposited at room temperature by reactive magnetron sputtering method. The nitride precursors were annealed at 500 ℃ for 30 min in air. The influences of DC and RF reactive magnetron sputterings on the structure and properties of oxidative annealed thin films were investigated. The results show that annealed thin films prepared by the two processes are all ZnO wurtzite structure, and n-type conduction. Samp...
出处
《电子元件与材料》
CAS
CSCD
北大核心
2010年第6期14-17,共4页
Electronic Components And Materials
基金
四川省教育厅重点资助项目(No.08ZA009)
西南科技大学博士基金资助项目(No.08ZX0102)
关键词
ZNO
稀磁半导体
磁控溅射
Al-N共掺杂
ZnO
diluted magnetic semiconductor
magnetron sputtering
Al-N co-doping
