摘要
研究在硅基表面形成1,1,2,2 H过氟癸基三氯硅烷防粘自组装膜的方法和特性。成功地在硅基表面形成了防粘连自组装薄膜,从浸润角、表面能、薄膜成分和表面粗糙度几个角度对该薄膜进行了分析,证实薄膜可将硅基表面能降低47.35%,可满足半导体工艺中的微纳器件加工工艺的防粘连涂层的需要。
The self-assemblage and the characteristics of the 1H, 1H, 2H, 2H-perfluorodecyltrichlorosilane film formed on the surface of silicon substrate as anti-adhesion layer were investigated, and it was realized that the self-assembled and anti-adhesive film was successfully formed on the surface of silicon. The characteristics of the formed, such as the contact angle of the film with water, the surface energy, the components and the roughness of the film, are analyzed. It is found that the surface energy of the silicon surface with the film is reduced 47.35% compared with the silicon surface without the film, indicating that the film can meet the requirement of anti-adhesion coating layers in the process of fabrication of micro/nano devices.
出处
《微细加工技术》
EI
2006年第6期36-39,共4页
Microfabrication Technology
基金
上海市科委纳米专项资助(0352nm010)
