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用于微流控芯片系统的超疏水表面的制备 被引量:1

Fabrication of Super-hydrophobic Surfaces for Microfluidic Chips
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摘要 为了分析超疏水表面的物理特性及应用前景,介绍了粗糙超疏水表面的两种理论模型,提出了一种基于MEMS加工技术的超疏水表面制备工艺,即利用ICP刻蚀工艺制备规则的硅方柱,并用旋转涂覆TeflonAF1600作为疏水薄膜,制备了疏水特性可控的硅表面。对接触角进行了测量,结果表明,在平整Teflon薄膜表面上,去离子水液滴的本征接触角约为117°,在边长间距比为10μm/35μm的方柱表面上的去离子水液滴显现接触角可达170°。另处,还给出了为避免Wenzel液滴出现的“安全”设计参数(方柱间距边长比小于2.5),以及一种基于润湿性梯度的微流体操控方案。 For analyses of physical characteristics and applications of the super-hydrophobic surfaces, two theoretical models of droplets on a rough hydrophobic. surface were introduced and a technique of the super-hydrophobic surfaces based on MEMS technology was proposed, i.e., an array of silicon pillars was obtained by ICP etching and Teflon [registered trademark] AF1600 was rotationally coated on the silicon pillar surfaces as the hydrophobic layer to obtain the hydrophobic-controllable surfaces. The results of the contact angles measured indicate that the equilibrium contact angle of deionized water on the flat Teflon [registered trademark] AF1600 film is about 117° and the apparent contact angle of deionized water on the super-hydrophobic pillars with a length-to-space ratio of 10/35 is about 170°. Additionally, some parameters for safe design (the length-to-spacer ratio is less than 2.5) were given to avoid appearance of the Wenzel droplets and a manipulation project for controlling microfluidics was proposed by wet gradient.
出处 《微细加工技术》 EI 2006年第3期36-39,共4页 Microfabrication Technology
基金 国家自然科学基金资助项目(10472055 60401009) 清华大学基础研究资金资助项目(JC2003060 JC2003061)
关键词 超疏水表面 微机械 ICP刻蚀 super-hydrophobic surfaces MEMS ICP etching
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参考文献9

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