摘要
硅 -硅键合晶片在机械减薄过程中产生的应力使硅片产生弯曲变形 ,这种变形在其后的加工过程中会使图形发生扭曲或位移 ,导致硅片加工中途报废。经过应力消除处理后可以顺利完成加工。
Stress induced during mechanical thinning of wafer to wafer bonding would make the wafer bend and distort,which would cause patterns to be twisted or displaced.The thinning induced stress and its effcet are investigated in the paper.
出处
《微电子学》
CAS
CSCD
北大核心
2002年第5期395-396,400,共3页
Microelectronics
关键词
硅-硅键合
介质隔离
辐射加固
Wafer to wafer bonding
Dielectric isolation
Radiation hardening
